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A4988 Stepper Motor Driver Module with Heatsink for 3D Printer Arduino

A4988 Stepper Motor Driver Module with Heatsink for 3D Printer Arduino

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Regular price HK$15.00
Regular price Sale price HK$15.00
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Delivery Options

  • Local delivery within Hong Kong and in-store pickup.​
  • Free shipping for orders of HK$400 or above; HK$35 shipping fee for orders below HK$400.​
  • Shipped by SF Express, usually dispatched the same day for orders confirmed before 6:00 PM (Mon–Sat).​
  • Estimated delivery time: 1–3 business days after dispatch (Hong Kong).​
  • In-store pickup details (location and time) will be confirmed by email or phone message.​
  • Delivery times are estimates and may be affected by weather or unforeseen circumstances.​

Overview

The A4988 stepper motor driver module is a microstepping driver with built‑in translator that simplifies control of bipolar stepper motors from a microcontroller or Arduino. It supports up to 35 V motor supply and up to 2 A per coil with proper cooling, making it suitable for NEMA 17 motors in Reprap 3D printers and CNC projects.

Key features

  • Input motor voltage 8–35 V, up to 2 A per phase (≈1 A continuous without extra cooling, more with included heatsink).
  • Five microstepping modes: full, 1/2, 1/4, 1/8 and 1/16 step for smoother and quieter motion.
  • Simple STEP and DIR control interface, compatible with 3.3 V and 5 V logic (Arduino, RAMPS, CNC controllers).
  • Adjustable current limit via on‑board potentiometer to match your stepper motor and reduce overheating.
  • Built‑in protections: thermal shutdown, undervoltage lockout, crossover‑current, ground‑fault and load short‑circuit protection.

Typical applications

  • Reprap‑style 3D printers using RAMPS or similar controller boards.
  • Desktop CNC machines, laser engravers and robotics requiring precise position control.
  • DIY motion‑control projects using Arduino, Raspberry Pi or other MCUs.

What’s included

  • 1 × A4988 stepper motor driver module (header pins pre‑soldered, red PCB version)
  • 1 × Aluminium heatsink with adhesive backing for improved thermal dissipation
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