Leaded Solder Paste Syringe 50g Sn63/Pb37 | 183°C Melting Point
Leaded Solder Paste Syringe 50g Sn63/Pb37 | 183°C Melting Point
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Short Product Description
Short Product Description
The JPT6337 Sn63/Pb37 Leaded Solder Paste is a premium medium-temperature (183°C) soldering solution designed for precision SMD component work and mobile phone repairs. Packaged in a convenient 35g syringe with included dispensing needles and a plunger, it ensures accurate application with zero waste. Featuring a fine 20-38μm mesh size, it guarantees bright, strong, and reliable solder joints. Available in-stock at Sun Cheong Computer Co. Ltd. (新昌電腦有限公司) in Sham Shui Po.
Key Features
Key Features
- Eutectic Alloy Formula: Sn63/Pb37 composition provides excellent flow characteristics and prevents cold solder joints.
- Medium Temperature (183°C): Lowers the required reflow temperature, protecting heat-sensitive PCB components from damage.
- Ready-to-Use Syringe Kit: Comes complete with a push plunger and two dispensing needles; no external caulking gun required.
- Fine Type 4 Mesh (20-38μm): Ensures smooth, clog-free dispensing for micro-soldering and fine-pitch IC work.
- Professional Results: Leaves minimal residue and creates bright, mechanically strong solder connections.
Full Product Description
Full Product Description
Precision Syringe Dispensing for SMD Repairs
This solder paste is packaged in a highly practical syringe tube, completely eliminating the mess and waste associated with traditional tub-based pastes. The kit includes a custom plunger and two dispensing needles, allowing you to apply microscopic amounts of solder paste exactly where you need it. This precise application is critical for micro-soldering tasks, such as replacing mobile phone charging ports (tail plugs), BGA reballing, and mounting densely packed Surface Mount Devices (SMD) on PCBs.
Optimal 183°C Medium Temperature Melting Point
Formulated with a classic Sn63/Pb37 (63% Tin / 37% Lead) eutectic alloy, this paste features a precise melting point of 183°C. This medium-temperature profile significantly reduces the thermal stress placed on sensitive electronic components and plastic connectors during the reflow process, compared to high-temperature lead-free alternatives. The fine 20-38μm particle size (Type 4 mesh) ensures smooth extrusion through the needle and results in robust, highly conductive, and bright solder joints.
Technician Tip
For best results, keep the solder paste sealed when not in use and follow the storage instructions provided on the product packaging. If refrigerated, allow it to return to room temperature for 1–2 hours before use. Do not force the plunger while the paste is cold, as this may damage the syringe.
Safety: This solder paste contains lead. Work in a well-ventilated area, avoid eating or drinking while soldering, and wash your hands thoroughly after handling.
Need soldering tools or PCB cleaning supplies? Visit Sun Cheong Computer Co. Ltd. in Sham Shui Po.
Technical Specifications
Technical Specifications
- Model: JPT6337
- Alloy Composition: Sn63/Pb37 (Leaded)
- Melting Point: 183°C (Medium Temperature)
- Particle Size (Mesh): 20-38μm (Type #4)
- Net Weight: 50g
- Packaging: Syringe tube
- Included Accessories: 1x Plunger, 2x Dispensing Needles
Delivery Options
Delivery Options
- Local delivery within Hong Kong and in-store pickup.
- Free shipping for orders of HK$400 or above; HK$35 shipping fee for orders below HK$400.
- Shipped by SF Express, usually dispatched the same day for orders confirmed before 6:00 PM (Mon–Sat).
- Estimated delivery time: 1–3 business days after dispatch (Hong Kong).
- In-store pickup details (location and time) will be confirmed by email or phone message.
- Delivery times are estimates and may be affected by weather or unforeseen circumstances.
FAQ Section
FAQ Section
Do I need a separate dispenser gun to use this solder paste?
No, a separate dispenser gun is not required. The package includes a custom-fit plastic plunger that inserts into the back of the syringe, allowing you to dispense the paste manually and precisely just like a standard medical syringe.
What is the advantage of Sn63/Pb37 over lead-free solder paste?
Sn63/Pb37 leaded solder has a lower melting point (183°C) and superior wetting properties compared to most lead-free pastes. This makes it much easier to work with during manual repairs, resulting in brighter, stronger joints while reducing the risk of heat damage to the motherboard.
How should I store this solder paste when not in use?
To prevent the flux from drying out and the paste from degrading, store the syringe in a refrigerator between 0°C and 10°C. Keep it away from direct sunlight and out of reach of children.
Is this suitable for soldering mobile phone charging ports?
Yes, this paste is highly recommended for mobile phone tail plug (charging port) repairs. The 183°C melting point is ideal for securing the port's anchor pins firmly to the logic board without melting the internal plastic components of the connector.
Is this syringe solder paste available for immediate pickup in Hong Kong?
Yes, we stock the JPT6337 Sn63/Pb37 Solder Paste Syringe at our Sham Shui Po physical store. You can order it online for delivery or visit us during business hours for instant pickup.
Target Users / Applications
Target Users / Applications
- Mobile Phone Repair Technicians: Replacing delicate Type-C or Lightning charging ports (tail plugs) without melting the plastic housings.
- PCB Rework Specialists: Performing BGA reballing or replacing fine-pitch SMD components on densely populated logic boards.
- Electronics Hobbyists: Assembling custom PCBs at home using a hot air rework station or a DIY reflow hotplate.
