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XG-50 Liquid Flux Solder Paste Sn63/Pb37 for BGA & SMT (35g)
XG-50 Liquid Flux Solder Paste Sn63/Pb37 for BGA & SMT (35g)
🔥 37 sold•✓ In stock
Regular price
HK$20.00
Regular price
Sale price
HK$20.00
Shipping calculated at checkout.
Quantity
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Delivery Options
Delivery Options
- Local delivery within Hong Kong and in-store pickup.
- Free shipping for orders of HK$400 or above; HK$35 shipping fee for orders below HK$400.
- Shipped by SF Express, usually dispatched the same day for orders confirmed before 6:00 PM (Mon–Sat).
- Estimated delivery time: 1–3 business days after dispatch (Hong Kong).
- In-store pickup details (location and time) will be confirmed by email or phone message.
- Delivery times are estimates and may be affected by weather or unforeseen circumstances.
The XG-50 Liquid Flux Solder Paste is a high-performance soldering material designed for precision electronics work. It uses a Sn63/Pb37 alloy and is ideal for BGA rework, SMT soldering, and chip-level repairs in mobile phones, computers, and digital devices.
Its fine particle size (25–45µm) and consistent viscosity allow smooth application and strong bonding, even on complex PCB layouts. With a low melting point of 183°C, it ensures efficient heat transfer and reliable solder joints during high-precision operations.
Key Features:
- Model: XG-50 Solder Paste
- Alloy Composition: Sn63/Pb37 (63% Tin / 37% Lead)
- Micron Size: 25–45µm
- Melting Point: 183°C
- Weight: 35g
- Size: 31mm (diameter) x 38mm (height)
- Application: BGA soldering, SMT assembly, chip repair, and reballing
- Packaging: Airtight container for extended shelf life
Ideal For:
- Mobile phone motherboard repair
- BGA/SMT reflow soldering
- High-precision PCB soldering
- Laptop, console, and computer service industries
Storage Tips:
Store in a cool, dry place or refrigerate for extended shelf life. Allow to return to room temperature before use.
