NC-559-ASM No-Clean Tacky Solder Flux Paste for BGA Repair (10cc)

Achieve professional-grade, reliable soldering results with our NC-559-ASM Tacky Solder Flux. Specifically designed for precision electronics work, this flux ensures excellent solder flow and strong joints while saving you cleanup time. Its high-viscosity, no-clean formula is a must-have for both professional technicians and hobbyists.

Key Features:

• No-Clean Formula: Leaves a minimal, transparent, and non-conductive residue. Eliminates the need for post-soldering cleaning with solvents, saving you time and effort.
• Tacky Consistency: The high-viscosity gel is perfect for holding components in place, which is essential for Surface Mount Device (SMD) and Ball Grid Array (BGA) work.
• Versatile Applications: Ideal for a wide range of advanced tasks, including BGA reballing, CSP repair, semiconductor packaging, and general SMD rework.
• Enhances Success Rate: Promotes superior wetting, allowing solder to flow evenly and create strong, durable connections, significantly improving the success rate of complex repairs.
• Precision Dispensing: The 10cc syringe allows for precise, controlled application, ensuring you use only the amount needed and minimizing waste.

Ideal For:

• Repairing computer motherboards (North/South bridge)
• Fixing graphics cards (GPU)
• Working on communication devices and mobile phones
• General electronics prototyping and repair

Specifications:

• Model: NC-559-ASM
• Volume: 10cc
• Type: No-Clean Tacky Solder Flux

What's Included:

• 1 x NC-559-ASM Solder Paste Syringe (10cc)