(SIZE): 31mm x 38mm
(Weight)：35g
(Alloy): Sn63/Pb37
(Microns): 25-45um
(Melting point):183degree
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
(SIZE): 31mm x 38mm
(Weight)：35g
(Alloy): Sn63/Pb37
(Microns): 25-45um
(Melting point):183degree
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.